Accurus Solder Ball
- Lead-Free Solder Ball
- Zero pollution
- Hypoxia property
- Precision
- Meet RoHS, REACH, SONY EU hazardous materials requirement

Product Feature
Manufactured from alloy and BGA Solder Ball, and R & D per customer needs. self-developed patent production equipment, can produce 0.889mm ~ 0.035mm high quality BGA solder ball, suitable for semiconductor and related industries for packaging.
Packaging material using anti-static material, static electricity can be attached to avoid the bottle, resulting in the use of distress. original patents were obtained, can be safe to use, no infringement concerns.
Product Specification/Packing Method

Low Alpha Solder: we can provide various of low alpha level product. Alpha particles <0.01 cph/cm2 , <0.002 cph/cm2, <0.001 cph/cm2
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