Assembly and bonding

Darbond® Low Temperature Thermosetting Structural Adhesive

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Darbond® 6206 (Low halogen)

  • Single component
  • High adhesion, low water absorption, good formability
  • Has good storage stability
  • Mainly used in COB bonding

Darbond® 6462 (High Performance)

  • Has good adhesion, sealing and flexibility
  • Fast curing at medium temperature
  • No corrosion, no pollution to the substrate and environment
  • Mainly used for structural bonding and sealing

Darbond® 6461HF (Low halogen)

  • Single component, low halogen content
  • Applicable range -40~180℃
  • Has good adhesive strength and temperature resistance
  • Mainly used in the bonding and sealing of transformers, inductors and other components

Darbond® 6655 (low halogen)

  • Single component, low halogen content
  • Fast curing at low temperature
  • High thixotropy, compatible with lead-free reflow
  • Mainly used for bottom reinforcement after assembly of BGA, CSP and other products

Technical Information

ProductColorChemistryViscosity (mPa·s)Shelf life
6206BlackEpoxy resin750003mths@2~8℃
6461HFGreyEpoxy resin1500004mths@2~8℃
6462BlackEpoxy resin83006mths@2~8℃
6655BlackEpoxy resin20006mths@2~8℃