Thermal Management Solutions

PI Composite Materials

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It is a heat-conducting pad composed of heat-conducting colloid and heat-conducting PI film. It has the characteristics of good flexibility, high strength, and high temperature aging resistance.

Typical Application

  • PTC component
  • Industrial control

DF-5500HTV/PID A product with good flexibility, high strength, and high temperature aging resistance can effectively reduce the interface thermal resistance of the surface of various electronic components and improve the heat dissipation capacity of electronic components.