SolderPlus Solder Paste
Nordson EFD dispensing and print solder pastes are industry leaders in Surface Mount Technology (SMT) with batch-to-batch consistency that helps reduce defects and rework.
Overview
When solder joints are needed but printing is not possible and solder wire is neither practical nor efficient, our SolderPlus® dispense paste is the solution. As a global leader in dispensing solutions, Nordson EFD has developed a family of high-quality solder pastes specifically formulated for dispensing applications. When paired with our benchtop dispensers, dispense valves, jetting systems, and robots, Nordson EFD solder pastes can provide a complete solution for your dispensing applications.
Benefits
- Consistent deposit sizes
- No missed deposits
- Clog-free top-to-bottom dispensing of the entire syringe barrel
- Long shelf life of 9 months from date of manufacture
- Packaged in Optimum® syringe barrels for best performance
SolderPlus Print Paste
When printing is possible, SolderPlus print pastes are precisely formulated for consistent application on printed circuit boards through stencils. We provide easy-to-print, robust pastes with good print definition, consistent print quality, and wide process windows. Nordson EFD’s print solder pastes provide dependable batch-to-batch consistency that can help reduce manufacturing costs by increasing first-pass yields and reducing defects, rework, and rejects.
Benefits:
- Long stencil life up to 24 hours
- Long pause-to-print capability
- High-speed printing
- Excellent tack strength
- Long shelf life of 1 year from date of manufacture
SolderPlus Selection Guide
Reference our Solder Paste Selection Guide to identify suitable alloy and flux options. Our product specialists can help you determine the best solution for your application, contact us at info@nordsonefd.com for recommendations.
Custom Formulations
For challenging applications where an off-the-shelf formula doesn’t solve your process needs, Nordson EFD can customize formulations to achieve ideal results. Whether it requires a non-standard alloy or a modified flux, our chemists can develop a formula with performance characteristics to maximize your first-pass yields.
Solder Paste Jetting Systems
As the industry leader in jetting technology, we are the only manufacturer that also specializes in solder paste development. We offer both the best jetting valves and the best jetting paste to deliver a complete, pre-qualified system.
Solder to Stainless Steel
Nordson EFD’s WS 71D00 solder paste is designed to wet challenging surfaces, including most 300 and 400 series stainless steels. No need for the higher expense of brazing when solder can do the job.
Low-Temperature Lead-Free
Nordson EFD has supplied the electronics industry with exceptional printing and dispensing low-temperature lead-free solder pastes for more than 30 years. Our fluxes are optimized for performance at the lower reflow temperatures required for temperature-sensitive products.
High-Temperature Reflow
High-lead solders require special fluxes that can survive reflow temperatures as high as 350° C (662° F). NC 09D00 and RMA 09D00 solder pastes not only survive high temperatures, they also have some of the lowest voiding of any paste on the market. WS 67P00 and WS 67D00 pastes facilitate high-temperature reflow when water wash capability is required.
High-Performance Solder Paste
Nordson EFD offers ISO-certified SolderPlus solder dispensing paste for today's advanced electronics manufacturing, including stencil applications.
