Inspection systems for fast inspection of hidden solder joints
Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.
Technology Highlights
- Inspection system with two quick-change objectives: 90° BGA optics (approx. 280 µm gap)
0° macro zoom inspection optics
- Fast inspection of hidden solder joints
- Integrated, dimmable LED illumination
- N-MOS color camera 5 megapixel, with USB connection
- Additional LED fiber light or LED light source with gooseneck and light fan
- Ideal for stationary inspection
- Ersa ImageDoc v3 inspection software (basic version) included
