Darbond® 6568 (Flip chip)

• Single component, high viscosity
  
• Fast curing at 170℃, repairable, good toughness, good high and low temperature resistance
  
• Mainly used for flip chip protection

Darbond® 6518 (General purpose)

• Single component, low halogen content
• 120°C fast curing, reworkable
• Mainly used in the protection of CSP, BGA, uBGA on laptop

Darbond® 6588 (Reworkable)

• Single component, high stability
• 130°C fast curing, reworkable
• Mainly used in the protection of BGA of various electronic products.

Darbond® 6563 (Chip level)

• Single component, low viscosity
• Fast curing at 170°C, reworkable
• Mainly used for flip chip fill protection

Darbond® 6571 (Low CTE)

• Single component, wide applicability
• Fast curing at 130℃, repairable, good toughness, good high and low temperature resistance
• Mainly used in the protection of CSP and BGA of smart terminals such as mobile phones and PADs

Darbond® 6582 (High viscosity)

• Single component high viscosity
• Fast curing at 120℃, repairable, good flexibility
• Mainly used for protection QFN

Technical Information