Hand-guided system for fast inspection of hidden solder joints
Compact, portable video microscope for inspecting solder joints in electronics manufacturing. It is designed for optical inspection and digital image recording as well as measurement tasks on solder joints of ball grid array (BGA), μBGA, CSP and flip chip devices.
Technology Highlights
- Mobile inspection system with two quick-change objectives (depending on equipment):
90° BGA optics (approx. 280 µm gap)
0° macro zoom inspection optics
- Fast, hand-guided inspection of hidden solder joints
- Integrated, dimmable LED illumination
- N-MOS color camera 5 megapixel, with USB connection
- Additional LED fiber light included with BGA optics
- Ideal for inspection at constantly changing locations and for servicing
- Ersa ImageDoc v3 inspection software (basic version) included
Specifications
ERSA MOBILE SCOPE basic unit
Dimensions (LxWxH) mm: 114 x 36 x 51 (without cable)
Weight in g: 210
Principle: integrated optical system with built-in camera and LED light source
Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics)
Light control: potentiometer (0-100%)
Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment
Focus adjustment: integrated focus ring on optics
Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics
