Flux is the linchpin that holds the soldering process together. High quality solder joints are made possible through the cleaning action of our FluxPlus™ paste flux. Regardless of your industry, your goal is to apply the right amount of flux, no more and no less, to the right location every time. You want the flux to stay where it is placed and secure your parts until heat is applied.

Features & Benefits

• Controlled flux spread as a result of precise dispensing
• Holds small parts in place before soldering
• Delivers more flux compared to flux-core wire solder
• Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.)
• Convenient sizes: 10cc, 30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars
• Compatible with range of dispensing solutions, including jetting systems

Applications

• Manufacture and repair of BGAs (screen printing materials with contrasting color)
• SMT rework and repair
• Fluxing of pre-bumped solder pads
• Prototype development and production

FluxPlus Formulations
Flux categories are defined by Military Specification QQ-S-571E as well as the IPC flux rating system. There are five main categories in QQ-S-571E. Each is available with a variety of activity levels, physical qualities of their residue, and cleaning methods required.

FluxPlus Families

No Clean (NC)
Consisting of rosin, solvent, and a small amount of activator, NC flux has low activity and is suited to easily soldered surfaces. NC residue is clear, hard, noncorrosive, non-conductive, and designed to be left on your assembly. Residue may be removed with an appropriate solvent.

Water Soluble (WS)
Consisting of organic acids, thixotrope, and solvent, WS flux comes in a wide range of activity levels for soldering to even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent. Residue is easily removed with 60° C (140° F) water at 40 psi (3 bar) pressure.

Rosin Mildly Activated (RMA)
Consisting of rosin, solvent, and a small amount of activator, most RMA flux is fairly low in activity and best suited to easily soldered surfaces. RMA flux residue is clear, soft, non-corrosive, and non-conductive. Cleaning is optional. Residue may be removed with an appropriate solvent.

Rosin Activated (RA)
Consisting of rosin, solvent, and aggressive activators, RA flux has higher activity than RMA for moderately oxidized surfaces. RA flux residue is corrosive and should be removed as soon as possible after reflow to prevent damage to your assembly. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent.